Scaling and Miniaturizing Photonic Integration (Panel)

23 Apr 2026
  • Silicon photonics for co-packaged optics  

  • Advances in III-V on silicon integration 

  • Miniaturization & its impact on AR/VR, 5G & edge computing 

  • Manufacturing & packaging challenges 

Chairperson
Royston Sequeira
Royston Sequeira, SOC Program Manager, GPU Technologies & Engineering - AMD
Speakers
Eviana Alice Breuss
Eviana Alice Breuss, Founder and CEO - TENGENA LLC
Paul Davids
Paul Davids, Distinguished Member of Technical Staff - Sandia National Labs
Tuqeer Nasir
Tuqeer Nasir, Business Development Director - General Graphene Corporation