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Speakers
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Chairperson
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Best practices for incorporating new tech to upskill efficiently
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Leveraging AI & automation to streamline training
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Building cross-functional teams for hardware & software integration
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Integrating next-gen tech while focusing on energy efficiency
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Preparing for Quantum computing & its disruptive potential
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Speakers
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Speakers
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- Silicon photonics for co-packaged optics
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Advances in III-V on silicon integration
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Miniaturization & its impact on AR/VR, 5G & edge computing
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Manufacturing & packaging challenges
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Boosting speed & bandwidth with PICs
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Advancements in wafer & fabrication technology driving scalability
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Impacts of AI on data center infrastructure
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Improving energy efficiency while managing cost pressures
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Integrating new tech while maintaining security & reliability
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Solving the thermal bottleneck: Integrating advanced interface materials to manage extreme heat densities in AI-driven photonic engines
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