Microelectronics US – Conference Program: Hero
Conference Program

The Ideas, Technologies and Leaders Shaping the Future of Hardware Innovation

The Microelectronics US conference program brings together the engineers, innovators, business leaders and policymakers driving the next generation of hardware innovation.

Across two days, discover visionary keynotes, in-depth technical sessions and real-world case studies covering the technologies enabling tomorrow's intelligent systems — with practical insights, valuable connections and a clear view of what's next.

Pre-Register → Book a Booth →
May 4–5, 2027
Palmer Events Center, Austin TX
Microelectronics US – Conference Program: Hardware Innovation Summit
Flagship Keynote Stage

Hardware Innovation Summit

The industry's biggest conversations shaping the future of hardware innovation.

The Hardware Innovation Summit is the flagship keynote stage at Microelectronics US, bringing together global technology leaders, policymakers, investors and end users to explore the opportunities and challenges shaping the future of the industry.

Expect visionary keynotes, executive panels and cross-disciplinary discussions covering AI, advanced manufacturing, investment, supply chains, workforce development and the continued growth of the Silicon Hills ecosystem.

Startup Showcase
Future Foundry

Our dedicated startup showcase highlighting breakthrough technologies, emerging companies and the innovators defining what's next.

Microelectronics US – Conference Program: Technical Conference Tracks
Technical Conference Tracks

Five Theaters. Deep-Dive Engineering.

Five dedicated technical theaters provide deep-dive engineering content delivered by experts from across industry, academia and research.

Select a track below to explore
Track 01
Foundational Technology

Semiconductor & Microelectronics

Explore the technologies driving the future of semiconductor innovation — from chip design through advanced manufacturing.

On the Agenda
Chip design, architecture & EDA Foundry, fabrication & process technologies Semiconductor materials, testing & reliability Domestic manufacturing & next-gen silicon
Track 02
Optical Innovation

Photonics & Optical Networking

Discover how photonics is transforming communications, sensing and high-performance computing.

On the Agenda
Silicon photonics & photonic integrated circuits (PICs) Optical communications & high-speed interconnects Imaging, sensing & LiDAR technologies Industry standards & interoperability
Track 03
Intelligent Systems

Embedded Systems & Edge AI

Explore the intelligent embedded technologies powering connected devices and real-time applications.

On the Agenda
Embedded hardware, software & real-time systems Edge AI & intelligent device development IoT, connectivity & secure embedded platforms Functional safety, low-power design & system integration
Track 04
Cross-Cutting Capability

Advanced Packaging & Manufacturing

Learn how advanced packaging and manufacturing technologies are enabling the next generation of compute.

On the Agenda
Chiplets, 2.5D/3D integration & heterogeneous packaging Advanced manufacturing, automation & assembly Thermal management, inspection & metrology Packaging technologies enabling next-gen compute
Track 05
Powering the AI Era

AI Infrastructure & Data Centers

Discover the hardware powering the AI revolution.

On the Agenda
AI accelerators, GPUs & high-performance computing Data center architecture, networking & storage Power, cooling & infrastructure optimization Compute platforms enabling the next gen of AI
Microelectronics US – Conference Program: Learn From the Experts
Speakers & Faculty

Learn From the Industry's Leading Experts

Hear from world-class engineers, researchers, executives and policymakers representing every part of the hardware innovation ecosystem. Through visionary keynotes, technical presentations, fireside chats and panel discussions, you'll gain practical insights, discover emerging technologies and connect with the people shaping the future of intelligent systems.

Pre-Register → Book a Booth →