Microelectronics US – The Technologies Driving Hardware Innovation (Hero)
The Ecosystem

The Technologies Driving Hardware Innovation

The future of intelligent systems is being built through advances in multiple interconnected technologies.

Microelectronics US brings together the organizations designing, manufacturing and integrating the core technologies that underpin next-generation electronic systems. By connecting these communities under one roof, the event creates opportunities for collaboration, knowledge exchange and commercial growth across the wider hardware innovation ecosystem.

Whether you're developing cutting-edge chips, advancing photonic integration, creating embedded platforms or solving packaging challenges, you'll find your community at Microelectronics US.

Semiconductor & Microelectronics
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Photonics
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Embedded Systems
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Advanced Packaging & Manufacturing
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Microelectronics US – Ecosystem Explorer (Tabs)
Explore by Technology

Four Communities. One Ecosystem.

Select a category below to explore
Semiconductor & Microelectronics
Foundational Technology

Semiconductor & Microelectronics

Semiconductors are the foundation of every modern electronic system. From chip architecture and design tools to fabrication, materials, packaging and test, this community represents the organizations driving the next generation of computing performance.

Key Areas
Chip Design & IP EDA Software Wafer Fabrication Semiconductor Manufacturing Equipment Materials & Chemicals Packaging & Test Reliability & Failure Analysis
Photonics
Optical Innovation

Photonics

Photonics is transforming communications, sensing, healthcare and AI infrastructure by enabling faster, more efficient data transmission and advanced optical technologies.

Key Areas
Silicon Photonics Optical Communications Lasers Imaging & Sensing Test & Measurement Optical Components Integrated Photonics
Embedded Systems
Intelligent Systems

Embedded Systems

Embedded technologies provide the intelligence that powers connected products across every industry, from industrial automation and robotics to medical devices and automotive systems.

Key Areas
Embedded Hardware Embedded Software Real-Time Operating Systems Edge Computing Industrial IoT Functional Safety System Integration
Advanced Packaging & Manufacturing
Cross-Cutting Capability

Advanced Packaging & Manufacturing

As device complexity continues to grow, packaging and manufacturing innovations have become critical to improving performance, efficiency and reliability.

Key Areas
Heterogeneous Integration Chiplets 2.5D & 3D Packaging Thermal Management Electronics Manufacturing Assembly & Test Advanced Manufacturing Processes
Microelectronics US – Better Together
Better Together

Where Technologies
Converge

Today's innovations don't emerge from a single discipline — they happen where technologies converge.

Microelectronics US creates an environment where semiconductor companies collaborate with photonics innovators, embedded engineers connect with manufacturing specialists, and new partnerships accelerate the development of tomorrow's intelligent systems.

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