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22 Apr 2026
    • Best practices for incorporating new tech to upskill efficiently 

    • Leveraging AI & automation to streamline training 

    • Building cross-functional teams for hardware & software integration 

    • Integrating next-gen tech while focusing on energy efficiency 

    • Preparing for Quantum computing & its disruptive potential 

23 Apr 2026
    • Silicon photonics for co-packaged optics  
    • Advances in III-V on silicon integration 

    • Miniaturization & its impact on AR/VR, 5G & edge computing 

    • Manufacturing & packaging challenges 

    • Boosting speed & bandwidth with PICs  

    • Advancements in wafer & fabrication technology driving scalability 

    • Impacts of AI on data center infrastructure 

    • Improving energy efficiency while managing cost pressures 

    • Integrating new tech while maintaining security & reliability  

    • Solving the thermal bottleneck: Integrating advanced interface materials to manage extreme heat densities in AI-driven photonic engines